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Advanced Packaging including Heterogeneous Integration & Chiplets 6/25 StdDcs-Current 18 and SEMI C3
Advanced Packaging including Heterogeneous Integration & Chiplets 6/25 StdDcs-Current 18 and SEMI C3
$497.50
Description
18 and SEMI C3
SEMI E173 — Specification for XML SECS-II Message Notation (SMN)
org發行線上版本，同年7月發行光碟版。
module requirement
Advanced Packaging including Heterogeneous Integration & Chiplets 6/25 StdDcs-Current 18 and SEMI C3Dates & Times June 25, 2026 8: 00 am 5 pm CT Early Bird $100 off Member $995 $895 Non Member $1095 $995 Location Aloft Tempe Meeting Room Tactic 951 East Playa Del Norte Drive Tempe, AZ 85281 480 621 3300 This one day course addresses IC packaging, assembly, and package substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i. e., smaller, better, cheaper and their influence on the
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
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- Delivery to the USA:
- Standard Shipping : 3-10 business days
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