S00600 - SEMI S6 - 半導體製造設備排氣通風基準 Revision:SEMI S6-0618 - Current or implantation onto or below

or implantation onto or below the surface of a circular silicon wafer having the opposite conductivity type from the thin layer to be measured or by the deposition of polysilicon over an insulating layer

SEMI E39 — Object Services Standard

SEMI G56 — Test Method Measurement of Silver Plating Thickness

Some terms are specialized to IC wafer and device production

S00600 - SEMI S6 - 半導體製造設備排氣通風基準 Revision:SEMI S6-0618 - Current or implantation onto or belowNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. Semiconductor Manufacturing EquipmentSME REF _Ref515551479 \h \r \t \* MERGEFORMAT 8 08D0C9EA79F9BACE118C8200AA004BA90B02000000080000000E0000005F005200650066003500310035003500350031003400370039000000 Referenced SEMI StandardsSEMI F5 Guide for