C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Revision:SEMI C104-0622 - Current 本文書は，450mmキャリアの外形と寸法を定めている。

本文書は，450mmキャリアの外形と寸法を定めている。

All liquid chemical standards consist of guidelines

This Standard provides specification for implementing basic equipment performance tracking (EPT) for production equipment

or unpolished

C10400 - SEMI C104 - Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing Revision:SEMI C104-0622 - Current 本文書は，450mmキャリアの外形と寸法を定めている。This Guide provides directions for measurements and reporting the parameters of chemical mechanical planarization (CMP) pad windows. This Guide provides directions for reporting metrology tools used to measure parameters of the CMP pad windows. This Guide provides the list of the parameters for CMP pad windows required to measure and report on quality documents. Reference to this Guide can be used in the quality documents (i. e., in the technical data