HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools As a base model to

As a base model to be used and extended by other SEMI Equipment Communication Standards

samples previously obtained and cleaned according to SEMI F40 are analyzed for trace inorganics using inductively coupled plasma-mass spectrometry (ICP-MS)

SEMI E87-1105 (technical revision)

Bonding wire

HB00200 - SEMI HB2 - Specification for 150 mm Open Plastic and Metal Wafer Cassettes Intended for Use for Manufacturing HB-LED Devices StdTpc-Cluster Tools As a base model toThis Standard was technically approved by the HB LED Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 17, 2018. Available at www. semiviews. org and www. semi. org in December 2018; originally published June 2013. This Specification provides the dimensional requirements for plastic and metal wafer cassettes used for the processing and handling of 150 mm diameter HB LED