C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 1-0310 (technical revision)

1-0310 (technical revision)

This Safety Guideline is intended to be used to ensure that decontamination prior to transportation occurs to the greatest extent possible

Analytical Procedures — The procedures used to establish a liquid chemical specification can be found in § 7

本スタンダードの目的は，ウェーハマウンティングプロセスとダイボンディングプロセスの間で使用する450mmウェーハ用テープフレームカセットのメカニカルな形状を標準化することである。

C09900 - SEMI C99 - Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals StdPbc-0309 1-0310 (technical revision)This Test Method provides a standardized test method for measuring and reporting the conductivity of slurries and post chemical mechanical polish (CMP) chemicals. This Test Method defines the number of significant digits to which conductivity will be reported, given the limitations of current metrology and methodology capabilities, and define a standardized temperature for the measurement. This Test Method also supplies a method of calibrating