G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded Static-control methods can be incorporated

Static-control methods can be incorporated in the factory design to reduce static charge to acceptable levels

The first stack (refer to Figure 1) is a BWS pair of 775 µm thick wafers following TSV formation and the bonding operation

and behavior is not required to be compliant to this Specification

Additions to the Standard are made utilizing the SEMI Standards balloting process

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded Static-control methods can be incorporatedThe purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds