Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working PCB Part No: JANCD-NTU01-1

PCB Part No: JANCD-NTU01-1

4 KLA-Tencor CRS-1010S Used

Removed from a Hitachi MU-712E Shallow Trench Etcher System

Range/Gas: 75 SCCM

Rudolph Technologies AT/SM Die Prep Kit F30 300mm Wafer Defect System Working PCB Part No: JANCD-NTU01-1Rudolph Technologies AT SM Die Prep Kit F30 300mm Wafer Defect System Working Inventory # A 19531 Model No: AT SM Die Prep Kit Removed from a Rudolph Technologies F30 300mm Wafer Mounter & Defect Inspection System Included Components Part No: 734202, Rev. A Part No: F30 Chuck O Ring Part No: Retaining Nut NSK Part No: HGP NZ1 NKS Part No: AFE CA, X Y AXIS NKS Part No: LG2, Z AXIS This Rudolph Technologies AT SM Die Prep Kit is used working surplus.