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Exhaust Ducting, Pu+Cu Wire, T=0.8, L=3M (DUCT-PU-D25) PCB Depaneling High-Volume Reflow Performance and Cooling

$53.00

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Description

High-Volume Reflow Performance and Cooling

The system uses controlled ultrasonic energy to remove solder paste from stencils

welded construction improves stability at high speeds

Smarter SMT Production

Exhaust Ducting, Pu+Cu Wire, T=0.8, L=3M (DUCT-PU-D25) PCB Depaneling High-Volume Reflow Performance and Cooling

Shipping Notes
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  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
  • If time is of the essence, please consider selecting expedited delivery for faster service.

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