Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced) Ingestion-build-239834 Batch drying tumblers manufacturers

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The following gases and vapours which can be produced or be present during welding and allied processes are covered:

Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (externally induced) Ingestion-build-239834 Batch drying tumblers manufacturers1 Scope and object This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. NOTE This test is identical to the test method contained in 1. 2 of chapter 4 of IEC 60749