LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished CeO2 Epi-thin film on YSZ Bottom Pressing Rod Body Length:
$40.52
Description
Bottom Pressing Rod Body Length: 20mm
Band Gap: 3
Related Ceramic substrate
5µL to 5mL upon request
LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished CeO2 Epi-thin film on YSZ Bottom Pressing Rod Body Length:Substrate Specifcations: Wafer Size: 5 x 5 x 0. 5 mm thickness + 0. 05 mm Wafer Orientation: (110) + 0. 5 Deg Polishing: One side CMP polished with free sub surface damaged Surface finish (RMS or Ra) : < 15A Package: Under 1000 class clean room, and in 100 grade plastic bag in a wafer container.
Shipping Notes
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- Standard Shipping : 3-10 business days
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